Anderson Floor Warming Underfloor Heating using LK Slotted Board EPS 16 is for laying on a load-bearing floors only; giving exceptionally low construction height. The system is made up of slotted insulation boards, 16mm thick, with an aluminium heat distribution plate, 0.5mm thick, factory fixed. The heat distribution plate covers the entire surface of the insulation board. The slotted board, turning board and feeding board are made of high density EPS and provides extremely high resistance to short and long term compression.
We recommend that to achieve optimum efficiency of the underfloor heating system the use of weather dependent (weather compensation) flow temperature control, properly balanced and set in line with the design for adjustment of the primary and loop flow. We also recommend the settings are recorded for future reference.
The plates must be laid on load bearing floors only. Suitable floor structures are solid floors or suspended floors of minimum 22mm floor grade chipboard fixed to joists spaced at a maximum of 600mm. Where ceramic tiles are to be used over suspended floors cross battens at 300mm. The system can be installed as floating or fixed structure; the choice depends on the kind of floor finish to be used.
1. Load-bearing floor construction
2. Vapour barrier, when installed “floating”
3. LK Slotted Board EPS 16
Dim. 1200 x 600 x 16mm with four slots, c/c 150mm, suitable for AFW Underfloor Heating Pipe PE-Xa 12. The aluminium heat distribution plate is factory fixed.
4. LK Turning Board EPS 16
Dim. 600 x 300 x 16mm
5. Cell foam
Adhesive s layer between insulation board and sub-floor, and between aluminium plates and ceramic tiling.
Parquet, solid wood or laminated floor
The heating plates are laid out ”floating” over a PE vapour barrier, then open-cell foam sheet, over which, is laid the final wood floor. Surface layer must be at least 9mm thick.
Vinyl or linoleum flooring
The heating plates are laid out ”floating” over a PE vapour barrier. Soft floor finishes require an additional sub-floor. Lay cellfoam over the heating plates then lay 12mm (minimum) chipboard over the cellfoam.
The heating plates are glued to the sub-floor. Levelling compound (filler) is applied to form a drainage slope (minimum 12mm thick adjacent to a floor drain). Vinyl flooring is then laid over the floor.
Ceramics or natural stone
The floor-based heating plates are glued to suitable strengthened sub-floor. Ceramic tiling/natural stone is fixed (adhesive) direct over the heating panels. Smallest approved tile size 10x10cm.
The heating plates are glued to the sub-floor. Levelling compound (filler) is applied to form drainage slope (minimum 12mm thick adjacent to a floor drain). A waterproof sealing layer or ceramic tiling is fixed to the floor.
AFW Heating Circuit Manifold
The AFW Heating Circuit Manifold must be installed as shown in the design drawing. Please read the instructions enclosed with the manifold first.
Before laying out the plates, inspect the sub-floor to ensure it is level to a maximum curvature ±3mm over a distance of 2 metres and ±1.2mm over a distance of 0.25 metres. The sub-floor must be vacuumed to remove any dirt or dust.
1. LK Turning boards
Begin the job by laying out the turning boards. Position the first turning board (which may need shortening) so that the pipe bends coincide with the intended pipe lay-out. Leave a minimum 5mm for expansion gap alongside walls and other fixed obstacles.
2. LK Slotted boards
Position the slotted boards so that a minimum 5mm is left for expansion alongside walls and other fixed obstacles. Cut slotted boards using a jig-saw. Ensure that no metal burrs are left in any pipe slots. Remove all burrs by using a file or sharp blade.
3. Feeding boards
Feeding boards are used for flow and return pipe runs, they are also used where the heating plates do not precisely fit a rooms dimensions. Leave a minimum 5mm for expansion alongside walls and other fixed obstacles.
Gluing of underfloor heating plates
We recommend two different brands of adhesive for gluing LK EPS 16 to load bearing floors; Bostik Multi Tac is suitable for use when looking for the lowest possible elevation. This adhesive should not however, be used on floors where there could be problems with rising damp, for example cellar floors. If there is a risk of rising damp it is best to use Kiilto Flyfix instead. For more information see the details under the respective brands below.
Please note, underfloor heating will not resolve potential problems with damp. You need to find the underlying reasons and resolve them first.
LK EPS 16 heating plates can be glued with Bostik Multi Tak to porous surfaces such as concrete, chipboard, plasterboard and cement tiles. There must be no rising damp present.
The surface should be free of oil, grease, paint or other substance that will prevent bonding. The Bostik Multi Tac is applied to the plates. The adhesive is spread/combed out with a notched trowel. Adhesive usage is approx. 2m²/l. Adjust/centre the turning boards and the slotted boards so that the pipe slots are aligned. Drying time is approx. 12 hours. Drying time is affected by both room temperature and humidity.
When gluing LK EPS 16 heating plates to a sub floor, it is particularly important that the plates are firmly pressed down into the glue to create the necessary adhesion. For good adhesion, it may be necessary to use sandbags/weights or to screw the plates down. Avoid “unnecessary treading” on the plates before the adhesive has properly set.
Adhesive thickness: approx. 1mm
LK EPS 16 heating plates can also be fixed with Kiilto Flytfix to porous surfaces such as concrete, chipboard, plasterboard and cement tiles.
The surface should be free of oil, grease, paint or other substances that will prevent bonding. Adjust/centre the turning boards and the slotted boards so that the pipe slots are aligned. Drying time is approx. 12-18 hours. Drying time is affected by room temperature and humidity.
Mix the Kiilto Flytfix with Kiilto Fixbinder; 5 litres of binder to 20 kg of Flytfix. (NOTE! No water). Spread the adhesive with a putty-knife; work in the adhesive before “combing” it out. Use a comb size of 6-8mm for the plate. Lay the plate and press firmly down into the adhesive.
When gluing LK EPS 16 heating plates to a sub floor, it is particularly important that the heating plates are firmly pressed down into the glue to create the necessary adhesion. For good adhesion, it may be necessary to use sandbags/weights or to screw the plates to the surface. Avoid “unnecessary treading” on the plates before the glue has properly set. Drying time is approx. 12-18 hours. Drying time is affected by room temperature and humidity.
Adhesive thickness: approx. 3-4mm
Priming of underfloor heating plates
The topside of the plates must be primed if the intension is to apply tiles directly to the plates. For this use Kiilto Start Primer.
Kiilto Start Primer has outstanding qualities as a primer for expanded polystyrene and aluminium. Ensure the plates are clean; vacuum or alternatively wet/dry vacuum carefully. There must be no grease or oil on the plates and any present must be cleaned off. Apply the Kiilto Start Primer with a brush, including any unused slots. Allow the primer to dry properly (the surface should be totally dry).
Laying the pipe
Plan the pipe lay-out so that flow and return pipes are not crossed.
The pipe lay-out must be done as the AFW drawing. Ensure the coil is laid so that outward flow runs along outer walls. Number and name the loops as per the drawing. Before laying out the pipe, check to see that there are no grit or sharps in the slots.
CAUTION: Where several flow and return pipes are connected to manifolds, the floor will have inadequate load bearing capacity. To ensure a level floor, that is strong enough to support furniture and other domestic loads, the insulation boards must be removed from the immediate area around the manifold and the pipes encapsulated in self levelling screed.
Press the pipe (by stepping on it) down and into the slotted board. For the installation to be properly complete the pipe must be fully in the slots and under no circumstances must the pipe come into contact with the overlying flooring.